The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2003

Filed:

Mar. 20, 2001
Applicant:
Inventor:

Wei-Wen Chen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/126 ; H01L 2/142 ; H01L 2/1425 ; C23C 1/600 ; A61N 5/00 ; G21G 5/00 ;
U.S. Cl.
CPC ...
H01L 2/126 ; H01L 2/142 ; H01L 2/1425 ; C23C 1/600 ; A61N 5/00 ; G21G 5/00 ;
Abstract

A method for forming an ultra-shallow junction by boron plasma doping is disclosed. A substrate is placed in a pulse type electric field. A flowing carrying gas drives boron ions in a channel above the substrate, and then a negative pulse type voltage is applied so that the boron ions may uniformly enter into the substrate. Then a rapid annealing process is performed so as to be formed with an ultra-shallow junction on the substrate. In the present invention, by the boron plasma doping, an ultra-shallow junction is provided on a surface of the substrate. Therefore, after the next thermal process, the property of the element can be retained. A lower depth junction is acquired, and the diffusion in the horizontal direction is suppressed.


Find Patent Forward Citations

Chen, Wei-Wen. (2003). Method for forming ultra-shallow junction by boron plasma doping (U.S. Patent No. 6531367). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6531367

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