The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2003

Filed:

Sep. 20, 2001
Applicant:
Inventors:

Ching-Ming Chen, Taipei, TW;

Yuh-Da Fan, Miao-Li County, TW;

Pao-Ling Kuo, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; G03F 7/20 ; G01N 1/102 ;
U.S. Cl.
CPC ...
H01L 2/100 ; G03F 7/20 ; G01N 1/102 ;
Abstract

A method for calibrating the wafer transfer system by using an inspection control wafer after plasma etching is described. An inspection control wafer is provided comprising a polysilicon layer overlying an oxide layer on the surface of a semiconductor substrate wherein the polysilicon layer does not cover the oxide layer for a first distance from the edge of the wafer. The inspection control wafer is entered into the wafer transfer system wherein the wafer is transferred to a spin-on-glass etchback chamber wherein the wafer is held by clamps which extend a second distance from the edge of the wafer and wherein there is designed an overlap difference between the first and second distances. The wafer is subjected to a spin-on-glass etchback step and then inspected for damage to the oxide layer. Oxide layer damage occurs if the second distance is less than the first distance by more than the overlap difference. Oxide layer damage indicates the need to recalibrate the wafer transfer system.


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