The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Jan. 21, 1999
Chien Ping Huang, Hsinchu Hsien, TW;
Randy H. Y. Lo, Taichung Hsien, TW;
Abstract
A Ball Grid Array (BGA) semiconductor package with exposed base layer includes a base layer having an opening portion in the center thereof and formed with a plurality of holes about the opening portion. A plurality of leads are attached to a second surface of the base layer and each of the leads is connected to a corresponding hole in the base layer. A semiconductor chip is attached and electrically connected to the leads. The semiconductor chip and the leads are covered by an encapsulant formed by an encapsulating compound, leaving a first surface of the base layer exposed. A plurality of solder balls are planted in the holes in the base layer, which are electrically bonded to the leads so as to electrically connect the semiconductor chip to external devices. In this BGA semiconductor package, the leads together with the base layer are used as a substrate for the semiconductor chip to attach thereto. Therefore, there is no need of costly BGA substrate.