The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2003

Filed:

Jun. 19, 2001
Applicant:
Inventors:

Tsunenori Yamauchi, Kawasaki, JP;

Hiroshi Kaneta, Kawasaki, JP;

Katsuhiro Homma, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/120 ;
U.S. Cl.
CPC ...
H01L 2/120 ;
Abstract

A semiconductor device comprises a silicon substrate of a resistivity above or equal to 800 &OHgr;·cm and an oxygen concentration under or equal to 5×10 cm , and an inductor formed in the silicon substrate. A concentration of oxygen contained in the silicon substrate is set to be low, whereby the silicon substrate is less vulnerable to thermal donor effect, and even in a case that a silicon substrate of high resistivity is used, a semiconductor device which suppresses conversion of a conduction type of the silicon substrate while having an inductance of high Q. It is not necessary to bury a highly resistive layer in the silicon substrate, whereby a semiconductor device having an inductance of high Q can be fabricated by simple fabrication steps, which contributes to cost reduction of the semiconductor device.


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