The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Jul. 14, 2001
Tzong Da Ho, Taichung, TW;
Chien Ping Huang, Hsinchu, TW;
Abstract
A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the toning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned beat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e. an exposed side of the heat sink to the atmosphere, so that the heat-dissipating efficiency is increase and the semiconductor package is more cost-effective to fabricate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile