The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Dec. 20, 2001
Ying-Chieh Chen, Taichung, TW;
Jeng-Yuan Lai, Taichung, TW;
Jzu-Yi Tien, Taichung, TW;
Chiung-Kai Yang, Tainan, TW;
Abstract
A multi-chip semiconductor package with a heat dissipating structure is proposed, in which a chip receiving cavity and an opening respectively formed in the heat dissipating structure and a chip carrier, are used to accommodate semiconductor chips therein with the chips being in direct contact with the heat dissipating structure, allowing heat generated by the chips to be rapidly dissipated through the heat dissipating structure. With the provision of through holes for interconnecting the chip receiving cavity and opening, gold wires pass the through holes and electrically connect the chips to the chip carrier. Such a structure with chips embedded in the chip receiving cavity and opening makes internal elements to be more compactly arranged in the semiconductor package, which is preferable in response to profile miniaturization of electronic product development.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile