The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Oct. 31, 2000
Applicant:
Inventors:
Chok J. Chia, Cupertino, CA (US);
Qwai H. Low, Cupertino, CA (US);
Patrick Variot, Los Gatos, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 ;
U.S. Cl.
CPC ...
H05K 1/09 ;
Abstract
A molded tape ball grid array package includes a molding compound and a tape substrate having a top surface for mounting a die thereon, a bottom surface for attaching solder balls, and vias for forming connections between the solder balls and the die wherein the molding compound surrounds the die and the tape substrate.