The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Nov. 22, 1996
Applicant:
Inventors:
Kuan-Chi Huang, Hsin-Chu, TW;
Chi-Shen Lo, Hsin-Chu, TW;
Assignee:
Taiwan SEmiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23G 1/00 ; B08B 1/04 ; B08B 3/08 ;
U.S. Cl.
CPC ...
C23G 1/00 ; B08B 1/04 ; B08B 3/08 ;
Abstract
The present invention provides a method for removing a coating layer of SOG or photoresist from a wafer flat side on a wafer by first injecting a flow of a cleaning solution at the bottom surface of the wafer at a location adjacent to the edge of the wafer, and then rotating the wafer at a rotational speed sufficiently high so as to cause the cleaning solution being pulled from the bottom side to the top side of the wafer by flowing around the edge to remove the coating layer covering the unintended area on the top surface of the wafer.