The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Apr. 05, 2001
I-Chung Tung, Hsinchu, TW;
Jiun-Shian Yu, TaiChung, TW;
Kuo-Bin Chen, ChiaYi, TW;
Shih-Ping Hsu, TaoYuan, TW;
Abstract
A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile