The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Oct. 20, 2000
Applicant:
Inventors:
Terence M. Thomas, Newark, DE (US);
Qianqiu (Christine) Ye, Wilmington, DE (US);
Joseph K. So, Newark, DE (US);
Peter A. Burke, Avondale, PA (US);
Assignee:
Rodel Holdings, Inc., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
A method for CMP polishing with a first step slurry composition selective to a metal in a metal layer to remove the metal at a high removal rate during polishing, and a second step slurry composition selective to a barrier film and least selective to either of an underlying dielectric layer or a metal interconnection structure in the dielectric layer, to remove the barrier film at a high removal rate during polishing, and level a surface of the dielectric layer to the surface of the interconnection structure.