The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Oct. 06, 2000
Homayoun Talieh, San Jose, CA (US);
Konstantin Volodarsky, San Francisco, CA (US);
Jalal Ashjaee, Cupertino, CA (US);
Douglas W. Young, Sunnyvale, CA (US);
Nutool, Inc., Milpitas, CA (US);
Abstract
The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile