The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Oct. 19, 2000
Igor Y. Khandros, Orinda, CA (US);
Thomas H. DiStefano, Monte Sereno, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A semiconductor chip assembly, comprises a first semiconductor chip having a front surface, a rear surface and contacts on the front surface and a second semiconductor chip having a front surface, a rear surface and contacts on the front surface. The rear surface of the second semiconductor chip is juxtaposed with the front surface of the first semiconductor chip. The assembly includes a first backing element having electrically conductive first terminals. The first backing element is juxtaposed with the rear surface of the first semiconductor chip so that at least some of the terminals overlie the rear surface of the first semiconductor chip. At least some of the contacts on the first and the second semiconductor chips are electrically connected to at least some of the terminals. The assembly includes a substrate having contact pads thereon. The first terminals are connected to the contact pads of the substrate. The substrate is adapted to connect the assembly with other elements of a circuit. At least some of the first terminals overlie the rear surface of the first semiconductor chip.