The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Dec. 04, 1998
Tomoji Watanabe, Tsuchiura, JP;
Nobuyuki Mise, Tsuchiura, JP;
Toshiyuki Uchino, Kodaira, JP;
Norio Suzuki, Kodaira, JP;
Yoshihiko Sakurai, Kodaira, JP;
Toshiya Uenishi, Kodaira, JP;
Yohsuke Inoue, Hitachi, JP;
Yasuhiro Inokuchi, Tokyo, JP;
Fumihide Ikeda, Tokyo, JP;
Kokusai Electric Co., LTD, Tokyo, JP;
Abstract
A semiconductor wafer processing apparatus comprises a reaction furnace capable of heating inside thereof, a wafer mount for mounting a semiconductor wafer thereon and a transfer device. The wafermount includes an opening which is greater than the semiconductor wafer and which has a circle shape or a shape substantially similar to an outer periphery of the semiconductor wafer, and includes a wafer supporting portion projecting inwardly of the opening for supporting the semiconductor wafer. The transfer device is capable of holding the wafer mount outside the semiconductor wafer as viewed from a vertical direction, and transferring the wafer mount carrying the semiconductor wafer thereon substantially horizontally into and/or out from the reaction furnace.