The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2002
Filed:
Jan. 31, 2000
Applicant:
Inventors:
Wen-Kuan Yeh, Chupei, TW;
Chih-Yung Lin, Taichung Hsien, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract
A copper fuse structure for integrated circuit employs two copper pads formed over a semiconductor substrate. The two copper pads are electrically insulated by dielectrics. An aluminum line is utilized to cover and electrically connect the two copper pads.
Yeh, Wen-Kuan. (2002). Copper fuse for integrated circuit (U.S. Patent No. 6455913). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6455913
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile