The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6449155 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 10, 2002

Filed:

Aug. 09, 2001
Applicant:
Inventors:

John Lee Colbert, Byron, MN (US);

John Saunders Corbin, Jr., Austin, TX (US);

Roger Duane Hamilton, Eyota, MN (US);

Danny E. Massey, Austin, TX (US);

Arvind Kumar Sinha, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.


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