The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
Mar. 30, 2000
Gary L. Swiss, Gilbert, AZ (US);
Thomas P. Glenn, Gilbert, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method for forming a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components is disclosed. The snapable multi-package substrate is formed with trenches that separate and define sections where individual packaged electronic components are fabricated in a snapable multi-package array, and where individual packaged electronic components are singulated from the snapable multi-package array of the invention by simply applying hand pressure to break or “snap” individual packaged electronic components apart.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile