The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
May. 26, 2000
Chien Ping Huang, Hsinchu, TW;
Tzong Da Ho, Taichung, TW;
Abstract
A BGA (Ball Grid Array) package fabrication method is proposed for the purpose of achieving solder ball coplanarity on a warped BGA package, such as a concavely-warped BGA package or a convexly-warped BGA package. The proposed method is characterized in the provision of a plurality of variably-sized solder-ball pads over the bottom surface of the substrate, each solder-ball pad having a specified size predetermined in accordance with pre-measured package warpage and predetermined relation of solder ball height against pad size. This provision allows the use of a solder mask having fixed-size openings, as contrary to the prior art that uses a solder mask having variably-sized openings, to allow the implanted solder balls to achieve coplanarity and have strengthened shear for robust solder joint.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile