The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2002

Filed:

Oct. 05, 2000
Applicant:
Inventors:

Chewnpu Jou, Hsinchu Hsien, TW;

Roger Yen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ; H01L 2/120 ; H01L 2/131 ; H01L 2/1469 ;
U.S. Cl.
CPC ...
H01L 2/14763 ; H01L 2/120 ; H01L 2/131 ; H01L 2/1469 ;
Abstract

A method of fabricating an interconnect of a capacitor. A substrate having a capacitor is provided. The capacitor comprises a bottom electrode electrically connected to the substrate, a dielectric layer and a top electrode thereon. A spin-on dielectric layer is formed on the substrate and the capacitor. The spin-on dielectric layer on the substrate is thicker than that on the top electrode. The spin-on dielectric layer is etched back until the top electrode is exposed. A patterned metal layer is formed on the spin-on dielectric layer and the top electrode with a bottom surface in directly contact with a top surface of the top electrode.


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