The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Dec. 06, 1999
Applicant:
Inventors:

Chin-Shien (Tony) Yang, Hsinchu, TW;

Chuan-Huai Chen, Taipei, TW;

Cheng-Kun Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 1/400 ; C25B 1/100 ; C25B 1/300 ; C25B 9/00 ;
U.S. Cl.
CPC ...
C23C 1/400 ; C25B 1/100 ; C25B 1/300 ; C25B 9/00 ;
Abstract

The uniformity of material removal, as well as contamination due to deposited particulate matter, has been reduced in single wafer sputter-etchers by providing an improved gas baffle. Said gas baffle presents a smooth surface to the incoming sputtering gas so that it disperses uniformly throughout the sputtering chamber, thereby avoiding local fluctuations in pressure which, in turn, can lead to local differences in material removal rate as well as to particulate contamination of the surface that is being etched. The design of the baffle is described along with a method for attaching it to the inside of the sputtering shield.


Find Patent Forward Citations

Yang, Chin-Shien (Tony). (2002). Sputter etching chamber with improved uniformity (U.S. Patent No. 6436253). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6436253

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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