The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Dec. 02, 1999
Applicant:
Inventors:
Bob Sankman, Phoenix, AZ (US);
Hamid Azimi, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 9/00 ;
U.S. Cl.
CPC ...
H01R 9/00 ;
Abstract
An integrated circuit package is provided that includes a multi-layer organic substrate. The substrate has conductive vias provided between isolated conductive layers. The vias are formed using a laser to cut through a dielectric layer separating the conductive layers. External interconnects in the form of T-shaped pins are soldered to the substrate of the integrated circuit package. An integrated circuit can be attached to the substrate using a flip-chip technique.
Sankman, Bob. (2002). Integrated circuit package (U.S. Patent No. 6430058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6430058
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile