The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
May. 03, 2000
Mario J. Interrante, New Paltz, NY (US);
Brenda Peterson, Wappingers Falls, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
William E. Sablinski, Beacon, NY (US);
Amit K. Sarkhel, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.