The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

Mar. 29, 2001
Applicant:
Inventors:

Bing Yeh, Los Altos Hills, CA (US);

Yaw-Wen Hu, Cupertino, CA (US);

Assignee:

Silicon Storage Technology, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/18247 ;
U.S. Cl.
CPC ...
H01L 2/18247 ;
Abstract

An electrically programmable memory cell is of the type having a floating gate and a control gate laterally spaced apart, and both insulated from a substrate. The floating gate and the control gate are made by a self-aligned method wherein, a first layer of silicon dioxide is provided on the substrate. A first layer of polysilicon is then provided on the first layer of silicon dioxide. The first layer of polysilicon is patterned and selective portions are removed. A second layer of silicon dioxide is provided on the patterned first layer of polysilicon. Portions of the second layer of silicon dioxide are selectively masked to define regions in the corresponding first layer of polysilicon which would become the floating gate. The second layer of silicon dioxide is anisotropically etched. The second layer of silicon dioxide is then isotropically etched. The first layer of polysilicon is anisotropically etched to defined the floating gate. Exposed portion of the first layer of polysilicon are then oxidized to form a sharp edge. Silicon dioxide is deposited on the second layer of silicon dioxide and the oxidized exposed portion of the first layer of polysilicon. A second layer of polysilicon is deposited on the deposited silicon dioxide. The second layer of polysilicon is anisotropically etched to form spacers around the second layer of silicon dioxide to form the control gate.


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