The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2002

Filed:

Jul. 16, 1999
Applicant:
Inventors:

Masaaki Tsuchihashi, Tokyo, JP;

Minoru Hanazaki, Tokyo, JP;

Hideki Oura, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/02 ;
U.S. Cl.
CPC ...
C23F 1/02 ;
Abstract

There is described a wafer processing apparatus intended to efficiently secure a wafer on an electrostatic chuck. A heater is disposed in a processing chamber for heating a wafer, and a dielectric plate for supporting the wafer is also disposed in the processing chamber. First and second electrodes are embedded in the dielectric plate, and first and second variable D.C. power supplies are disposed so as to supply voltages to the first and second electrodes, respectively. After the wafer has been placed on an electrostatic chuck, the wafer is pre-heated before being subjected to attraction force. After completion of the pre-heating phase, the first and second D.C. power supplies supply voltages to the first and second electrodes, thus securing the wafer on the dielectric plate.


Find Patent Forward Citations

Loading…