The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2002
Filed:
Sep. 13, 2000
Chien-Hsin Lai, Kaohsiung Hsien, TW;
Hui-Shen Shih, Changhua Hsien, TW;
Jung-Nan Tseng, Hsinchu Hsien, TW;
Huang-Yi Lin, Taichung Hsien, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A detecting device for monitoring any abnormality in chemical-mechanical polishing. The detecting device includes a motor, an inverter, a control circuit, a rotation sensor, a current sensor, a relay controller and a chemical-mechanical controller. The inverter converts a direct current into an alternating current for driving the motor. The control circuit controls size and functioning of the output alternating current from the inverter. The rotation sensor is a transducer for converting the running speed of the motor into a rotation signal and transmitting the signal to the control circuit. The current sensor monitors the size of the alternating current flowing to the motor and then outputs a current signal. The relay controller receives the current signal from the current sensor and outputs a drive signal. The chemical-mechanical polishing controller receives the drive signal from the relay controller and outputs a system halt signal to the control circuit. The detecting device of this invention is able to detect any serious scratching or chipping of a silicon chip during a chemical-mechanical polishing operation so that the amount of damaged chips is greatly reduced.