The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Nov. 10, 1999
Brian Aegerter, Kalispell, MT (US);
Curt T. Dundas, Kalispell, MT (US);
Michael Jolley, Kalispell, MT (US);
Tom L. Ritzdorf, Kalispell, MT (US);
Steven L. Peace, Kalispell, MT (US);
Gary L. Curtis, Kalispell, MT (US);
Raymon F. Thompson, Kalispell, MT (US);
Semitool, Inc., Kalispell, MT (US);
Abstract
In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.