The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Nov. 24, 1999
Jui-Hsiang Pan, Hsin-Chu, TW;
Abstract
The present invention proposes a die seal ring. The provided die seal ring is formed on a substrate and is used to encompass a die by locating between the die and adjacent scribe lines. Moreover, the provided die seal ring comprises a plurality of dielectric layers and a plurality of metal structures, wherein any metal structure is not overlapped with other metal structures. Moreover, dielectric layers are located on the substrate in sequence, and each metal structure is stacked by one metal ring and one metal plug. In addition, any metal ring is located on a dielectric layer and is covered by another dielectric layer, and metal rings of different metal structures are located on different dielectric layers. Further, any metal plug is located in the dielectric layers and is used to connect the metal ring to the substrate. Of course, if the aspect ratio of any metal plug is too large to be properly formed, an appendant metal ring is used to reduce the aspect ration of the metal plug. Therefore, owing to the fact that any metal ring can directly connect to the substrate without application of another metal ring except the aspect ration is too large, the height of any metal structure can be efficiently reduced and then the height of the presented seal ring also can be efficiently reduced.