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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6403498 B1

PDFFull Text
Date of Patent:
Jun. 11, 2002

Filed:

Nov. 30, 1998

Method and device for treating substrate

Applicant:
Inventors:

Takenobu Matsuo, Tokyo, JP;

Tsuyoshi Wakabayashi, Tokyo, JP;

Teruyuki Hayashi, Tokyo, JP;

Misako Saito, Tokyo, JP;

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

Pillsbury Winthrop LLP

Primary Examiner:

David Nelms

Assistant Examiner:

Reneé R Berry

Int. Cl.
CPC ...
H01L 2/131 ;
U.S. Cl.
CPC ...
H01L 2/131 ;
Abstract

A substrate processing method of processing a surface of a substrate in manufacture of a semiconductor device, characterized by comprising a surface processing step for making a substance having an adsorption heat higher than that of an organic matter whose adsorption on the surface of the substrate, which has been cleaned, is undesirable, adsorbed on the surface of the substrate, and a film formation step for forming a thin film on the surface of the substrate which was processed in the above step.

Find Patent Forward Citations

Matsuo, Takenobu. (2002). Method and device for treating substrate (U.S. Patent No. 6403498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6403498

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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