The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Apr. 16, 2001
Jichen Wu, Hsinchu Hsien, TW;
Meng Ru Tsai, Hsinchu Hsien, TW;
Nai Hua Yeh, Hsinchu Hsien, TW;
Chen Pin Peng, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
An stacked structure of semiconductor means and method for manufacturing the same, comprises a substrate, a lower semiconductor chip, an adhered glue layer, a plurality of wires and an upper semiconductor chip. The adhered glue layer located between the substrate and the lower semiconductor to adhere the lower semiconductor to the substrate. The overflow glue of the adhered glue layer covered above the periphery of the lower semiconductor chip. The plurality of wires each being electrically connected to the lower semiconductor chip and the substrate, so that each wires are located above the overflow glue. The upper semiconductor chip is located above lower semiconductor chip and electrically connected to the substrate.