The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Feb. 04, 1999
Hisashi Masumura, Fukushima-ken, JP;
Fumio Suzuki, Fukshima-ken, JP;
Kouichi Okamura, Niigata-ken, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
There is disclosed a method of processing a work comprising polishing a work holding surface of a work holding plate by contacting and rubbing a work holding surface of a work holding plate with a polishing pad attached on a polishing turn table with providing polishing agent thereto, holding a wafer W on said work holding surface by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad to polish the work with providing polishing agent wherein temperature of the polishing agent or the polishing turn table is controlled by temperature controller so that a temperature of said work holding surface when polishing said work holding plate and a temperature of said work holding surface when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.