The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Dec. 30, 1999
Applicant:
Inventors:
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
The present invention is a method for identifying defective elements in array molding of semiconductor packaging for mini BGA packaging substrate which comprises a circuit zone and a periphery zone. The method of the present invention is first to form a plurality of package sites disposed in array in the circuit zone, and to form a plurality of marks in a periphery zone. When a defective element is found in the package sites, a symbol is put at the mark or an electronic file is employed to record the location of the defective element, thereby, the defective element in the package sites of the molding array in the circuit zone can be identified.