The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Mar. 03, 1999
Applicant:
Inventors:
Thomas Laursen, Tempe, AZ (US);
Malcolm K. Grief, Chandler, AZ (US);
Krishna P. Murella, Tempe, AZ (US);
Sanjay Basak, Chandler, AZ (US);
Assignee:
SpeedFam-IPEC Corporation, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 ; B08B 3/08 ; C23G 1/02 ;
U.S. Cl.
CPC ...
B08B 3/04 ; B08B 3/08 ; C23G 1/02 ;
Abstract
A method of conditioning pads used in the polishing of semiconductor wafers containing copper circuitry. The method includes applying a treatment solution that contains a reactant for particulate copper-containing debris on the pad resulting from the copper circuitry. Preferably, the reactant is a carboxylic acid present in a concentration of from about 0.1 to about 10 weight percent in a solution. The pH of the solution may be adjusted to the range from about 1 to about 6 with a compatible base.