The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Aug. 30, 1999
John Charles Desko, Wescosville, PA (US);
Muhammed Ayman Shibib, Wyomissing, PA (US);
Agere Systems Guardian Corp., Orlando, FL (US);
Abstract
There is described a method of making a bonded wafer by diffusing regions of a first wafer proximate a first major surface. Trenches are etched a predetermined distance into the first wafer from the first major surface toward a second major surface. The first major surface and trenches are coated with oxide. The first major surface of the first wafer is bonded to a second wafer to form a bonded wafer. The second major surface of the bonded wafer which is also the second major surface of the first wafer is ablated until oxide in the trenches is detected. The bonded wafer is cut into chips which are packaged as integrated circuits.