The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Mar. 09, 2001
Applicant:
Inventors:

Chih-Hsing Yu, Hsinchu, TW;

Dahcheng Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18242 ;
U.S. Cl.
CPC ...
H01L 2/18242 ;
Abstract

A method of planarizing the peripheral circuit region of a DRAM. A first oxide layer and a silicon nitride layer are sequentially formed over a substrate. A plurality of polysilicon plugs are formed within the crown-shaped capacitor region of the DRAM. A patterned second oxide layer is formed over the silicon nitride layer. A conformal doped amorphous silicon layer is formed over the exposed surface of the crown-shaped capacitor region and the peripheral circuit region of the DRAM. A photoresist layer is formed over the crown-shaped region and then a nitrogen implant is carried out to form a silicon oxy-nitride barrier layer. A chemical-mechanical polishing is carried out to separate the various lower electrodes. The photoresist layer and the second oxide layer within the crown-shaped capacitor region are removed. Hemispherical silicon grains are grown on the exposed surface of the doped amorphous silicon layer. A dielectric layer and an upper electrode layer are sequentially formed over the hemispherical silicon grains on the doped amorphous silicon layer.


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