The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Sep. 08, 1999
Igor Y. Khandros, Orinda, CA (US);
Thomas H. Distefano, Monte Sereno, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A method of making semiconductor chip assemblies includes providing a semiconductor wafer including a plurality of semiconductor chips having contacts on a contact bearing surface thereof and providing a substrate having a first surface with a plurality of conductive terminals located thereon and a second surface. The substrate is then assembled with the wafer so that the terminals are electrically connected to the contacts on the chips and portions of the substrate are removed to expose the terminals. In certain embodiments, an encapsulant may be injected between the wafer and the substrate for providing a compliant layer.