The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2002

Filed:

Apr. 02, 2001
Applicant:
Inventors:

Olubunmi O. Adetutu, Austin, TX (US);

Yeong-Jyh T. Lii, Austin, TX (US);

Paul A. Grudowski, Austin, TX (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/976 ; H01L 2/348 ; H01L 2/18238 ; H01L 2/176 ; H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/976 ; H01L 2/348 ; H01L 2/18238 ; H01L 2/176 ; H01L 2/14763 ;
Abstract

Insulating layers between transistors that are very close together may have voids. When contacts are formed in these areas between these close transistors, the contact hole is formed at the void location. These voids may extend between the contact locations that are close together so that the deposition of the conductive material into these contact holes may extend sufficiently into the void to short two such contacts. This is prevented by placing a liner in the contact hole, which constricts the void size in the contact hole, prior to depositing the conductive material. This restricts ingress of conductive material into the void. This prevents the void from being an unwanted conduction path between two contacts that are in close proximity. The bottoms of the contact holes are etched to remove the liner prior to depositing the conductive material.


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