The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2002
Filed:
Jan. 21, 2000
Abstract
A BGA (Ball Grid Array) integrated circuit package is proposed, which is characterized in the use of a ground metallic layer adhered to a substrate. Moreover, the ground metallic layer can provide the semiconductor chip with a heat-dissipation path, allowing heat from the semiconductor chip during operation to be dissipated to the atmosphere via the ground metallic layer, so that the overall heat-dissipation efficiency can be increased. The ground metallic layer is formed with a chip-receiving cavity for accommodating a semiconductor chip mounted on the substrate. As the semiconductor chip is surrounded and in close proximity to the ground metallic layer, it can help reduce undesired simultaneous switching noise, crosstalk, and electromagnetic interference in the integrated circuit package.