The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2002
Filed:
Mar. 31, 2000
Takayuki Ohba, Yokohama, JP;
Semiconductor Leading Edge Technologies, Inc., Yokohama, JP;
Abstract
The present invention provides a method for wiring, which plugs conductive material sufficiently into a via hole produced in dielectronics (hereinafter, referred to as “a via hole”) and prevents generating a void. The via hole is made through a via hole patterning step and a cleaning step. At a surface treatment step, substance having chemical affinity (active site) is adsorbed to the surface of the via hole. Next, an electron donative layer is made by depositing substance having an electron donative characteristic on the active sites acting as cores at an electron donative layer formation step. Then, the wiring material is plugged at a via hole plug step.