The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Aug. 16, 2000
Chih-Lung Lin, Taipei, TW;
Wen-Cheng Chien, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd, Hsin Chu, TW;
Abstract
Within a chemical mechanical polish (CMP) method there is first provided a first control substrate, a first series of product substrates and a second control substrate. There is then sequentially chemical mechanical polish (CMP) planarized, while employing a chemical mechanical polish (CMP) planarizing method, the first control substrate to provide a planarized first control substrate, the first series of product substrates to provide a planarized first series of product substrates and the second control substrate to provide a planarized second control substrate. There is then determined, for the planarized first control substrate and the planarized second control substrate, a corresponding first value of a parameter within the chemical mechanical polish (CMP) planarizing method and a corresponding second value of the parameter within the chemical mechanical polish (CMP) planarizing method. There may then be interpolated or extrapolated from the first value of the parameter and the second value of the parameter to provide an interpolated value of the parameter for a planarized first product substrate within the planarized first series of product substrates or an extrapolated value of the parameter which may be employed for planarizing with enhanced uniformity a second product substrate within a second series of product substrates.