The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2001

Filed:

Nov. 23, 1998
Applicant:
Inventors:

Brian Samuel Beaman, Hyde Park, NY (US);

Keith Edward Fogel, Mohegan Lake, NY (US);

Paul Alfred Lauro, Nanuet, NY (US);

Maurice H. Norcott, Fishkill, NY (US);

Da-Yuan Shih, Poughkeepsie, NY (US);

George Frederick Walker, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/14 ;
U.S. Cl.
CPC ...
H01R 9/14 ;
Abstract

A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.


Find Patent Forward Citations

Beaman, Brian. (2001). Method of making high density integral test probe (U.S. Patent No. 6332270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6332270

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…