The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2001
Filed:
Nov. 05, 1999
James M. Fusaro, Scottsdale, AZ (US);
Robert F. Darveaux, Higley, AZ (US);
Pablo Rodriguez, Gilbert, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
Methods of making integrated circuit device packages and substrates for making the packages are disclosed. An embodiment of a method of making a substrate includes providing an unpatterned sheet of polyimide material having a first surface and an opposite second surface. A planar metal layer is attached to the second surface of the polyimide sheet. The metal layer is patterned to form an array of package sites, with each site including a planar die pad and planar leads. Apertures are formed through the polyimide sheet, either before or after attaching the metal layer. Each aperture is juxtaposed with a lead allowing access thereto. A method of making a package using the substrate includes mounting an integrated circuit device above the die pad (e.g., on the substrate or on the die pad through an aperture in the substrate). Bond wires are connected between the integrated circuit device and the leads through the apertures. An insulative encapsulant is applied so as to cover the integrated circuit device and fill the apertures. A method of making multiple packages includes a final step of cutting an encapsulated array of package sites with a saw to separate individual packages.