The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Dec. 18, 1998
Applicant:
Inventors:

Yoshitaka Nakamura, Ome-shi, Tokyo, JP;

Hideo Aoki, Musashimurayama-shi, Tokyo, JP;

Yoshikazu Ohira, Ome-shi, Tokyo, JP;

Tadashi Umezawa, Ome-shi, Tokyo, JP;

Satoru Yamada, Ome-shi, Tokyo, JP;

Keizou Kawakita, Ome-shi, Tokyo, JP;

Isamu Asano, Iruma-shi, Saitama, JP;

Naoki Fukuda, Ome-shi, Tokyo, JP;

Tsuyoshi Tamaru, Hachioji-shi, Tokyo, JP;

Hidekazu Goto, Fussa-shi, Tokyo, JP;

Nobuyoshi Kobayashi, Kawagoe-shi, Saitama, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/7108 ;
U.S. Cl.
CPC ...
H01L 2/7108 ;
Abstract

A semiconductor integrated circuit device and a method of manufacturing such a device provides the advantages that undulations are prevented from being produced in the polycrystal silicon plugs in the bit line contact holes and that the undesired phenomenon of transversally etching the silicide film at the contacts of the bit lines and the polycrystal silicon plugs is avoided. The bit lines BL formed at the time of forming a first wiring layer,is made of a laminate film having a titanium film,a titanium nitride film,and a tungsten film,and a titanium silicide film,containing nitrogen or oxygen is formed in the contact areas of the bit lines BL and the plugs,A titanium silicide film,containing nitrogen or oxygen is also formed in the contact areas of the first wiring layer,and the semiconductor substrate,The titanium silicide film,may be replaced by a tungsten silicide film containing nitrogen or oxygen, a cobalt silicide film containing nitrogen or oxygen or a cobalt silicide film.


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