The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Apr. 28, 2000
Applicant:
Inventor:
Haochieh Liu, Taipei, TW;
Assignee:
Winbond Electronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
A fabrication method for a dual damascene structure is described wherein a substrate covered by a HSQ layer is provided. An E-beam curing is conducted on the HSQ layer where the via hole is to be formed. Photolithography and etching are further conducted on the HSQ layer to form a trench. Since the E-beam cured HSQ layer and the thermally cured HSQ layer have a high etching selectively ratio, the HSQ layer that has not been E-beam cured can be wet etched to from a via hole. A dual damascene structure is formed after filling the trench and the via hole with a conductive material, wherein either the via hole or the trench can be first formed.