The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Oct. 14, 1999
Seiji Ichikawa, Tokyo, JP;
Takeshi Umemoto, Tokyo, JP;
Toshiaki Nishibe, Tokyo, JP;
Kazunari Sato, Tokyo, JP;
Kunihiko Tsubota, Tokyo, JP;
Masato Suga, Tokyo, JP;
Yoshikazu Nishimura, Tokyo, JP;
Keita Okahira, Tokyo, JP;
Tatsuya Miya, Tokyo, JP;
Toru Kitakoga, Tokyo, JP;
Kazuhiro Tahara, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.