The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2001

Filed:

Feb. 02, 2000
Applicant:
Inventors:

Akira Sugawara, Toyooka-mura, JP;

Yoshitake Hana, Toyooka-mura, JP;

Takayoshi Endo, Haibara, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 ; C23C 2/800 ; C23C 8/06 ; C25D 5/50 ;
U.S. Cl.
CPC ...
B05D 3/02 ; C23C 2/800 ; C23C 8/06 ; C25D 5/50 ;
Abstract

A process for the production of copper or a copper base alloy that provides a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile by having a decreased coefficient of friction on the surface and improved resistance to abrasion. The process comprises coating copper or a copper alloy with Sn, followed by heat treating the resulting Sn-plated copper or copper base in an atmosphere having an oxygen content of no more than 5%, thereby forming on an outermost surface thereof an oxide film and beneath the surface a layer of an intermetallic compound mainly comprising Cu—Sn.


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