The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Dec. 21, 1999
Imran Yusuf, Tempe, AZ (US);
Biju Chandran, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment, is a deformable tube that is supported by a base structure. The tube, heat sink and base can be formed from a conductive material to provide an EMI shield for the integrated circuit. Retention mechanisms are used to provide either a fixed or an adjustable compression force to place the heat sink in thermal contact with the integrated circuit. The compressible support structure supports the heat sink, but also absorbs vibration and shock forces exerted on the heat sink to reduce the amount of forces transferred to the integrated circuit.