The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2001

Filed:

Jul. 21, 2000
Applicant:
Inventor:

Osamu Tanigawa, Nagoya, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; H01L 2/164 ; B65G 2/500 ; B65G 2/102 ;
U.S. Cl.
CPC ...
H01L 2/100 ; H01L 2/164 ; B65G 2/500 ; B65G 2/102 ;
Abstract

A wafer treatment apparatus is divided into a working zone (S,) and a loading zone (S,) by a wall (,). A closed wafer cassette(,) has a cassette body,having a bottom wall provided witha normally closed valve (,). A vent pipe (,) has one end part projecting from a cassette table (,) disposed in the working zone (S,) and the other end part opening into the loading zone (S,). When the cassette (,) is placed on the cassette table (,), the vent pipe (,) wedges through an incision formed in the valve (,) into the wafer cassette (,) to enable the interior of the cassette (,) to communicate with the loading zone (S,). Consequently, the pressure difference between the interior of the cassette (,) and the loading zone (S,) is reduced to naught.


Find Patent Forward Citations

Tanigawa, Osamu. (2001). Method and apparatus for wafer processing (U.S. Patent No. 6302927). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6302927

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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