The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
Aug. 30, 1999
Su Tao, Kaohsiung, TW;
Yu-Ching Tsai, Kaohsiung Hsien, TW;
Meng-Hui Lin, Kaohsiung, TW;
Chin-Ming Chung, Kaohsiung Hsien, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method for packaging a BGA and the structure of the BGA for using the method are disclosed. The structure of the substrate of the BGA includes multiple pairs of aligned slots (,) defined along the X-axis thereof, and a passage (,) corresponding to and perpendicular to one pair of aligned slots (,). While using the method to package the substrate, one side of the substrate will be entirely covered by a first protective layer to protect the chips and the other side of the substrate will form multiple lines of a second protective layers to protect the bonding wires.