The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
May. 03, 1999
Cindy Reidsema Simpson, Austin, TX (US);
Robert Douglas Mikkola, Austin, TX (US);
Matthew T. Herrick, Austin, TX (US);
Brett Caroline Baker, Austin, TX (US);
David Moralez Pena, Buda, TX (US);
Edward Acosta, San Marcos, TX (US);
Rina Chowdhury, Austin, TX (US);
Marijean Azrak, Austin, TX (US);
Cindy Kay Goldberg, Austin, TX (US);
Mohammed Rabiul Islam, Austin, TX (US);
Motorola Inc., Schaumburg, IL (US);
Abstract
A method for electroplating a copper layer (,) over a wafer (,) powers a cathode of an electroplating system (,) in a manner that obtains improved copper interconnects. A control system (,) powers the cathode of the system (,) with a mix of two or more of: (i) positive low-powered DC cycles (,or,); (ii) positive high-powered DC cycles (,or,); (iii) low-powered, pulsed, positive-power cycles (,or,); (iv) high-powered, pulsed, positive-powered cycles (,or,); and/or (v) negative pulsed cycles (,or,). The collection of these cycles functions to electroplate copper or a like metal (,) onto the wafer (,). During electroplating, insitu process control and/or endpointing (,or,) is performed to further improve the resulting copper interconnect.