The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2001

Filed:

Mar. 24, 1999
Applicant:
Inventors:

Shao-Wen Hsia, Mission Viejo, CA (US);

Michael J. Berg, Mechanicsville, VA (US);

Maureen R. Brongo, Laguna Hills, CA (US);

Assignee:

Conexant Systems, Inc., Newport Beach, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

Method and apparatus for plasma etching both metal and inorganic dielectric layers in a single chamber during deep sub-micron semiconductor fabrication. Fluorine based chemistries, or a mixture of fluorine and chlorine based chemistries, are used to etch the inorganic dielectric layer. A switch is then made to chlorine based chemistries, within the same etching chamber, which are utilized to etch the metal layer. Overetching may also be performed with chlorine based chemistries to clear any residuals.


Find Patent Forward Citations

Hsia, Shao-Wen. (2001). Method and apparatus for high-resolution in-situ plasma etching of inorganic and metal films (U.S. Patent No. 6291361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6291361

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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