The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Aug. 12, 1998
Applicant:
Inventors:
Anthony F. Beier, Spokane, WA (US);
Janine K. Kardokus, Otis Orchards, WA (US);
Susan D. Strothers, Spokane, WA (US);
Assignee:
Honeywell International, Inc., Morristown, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/434 ; B23K 2/000 ;
U.S. Cl.
CPC ...
C23C 1/434 ; B23K 2/000 ;
Abstract
Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.